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商品編號： NA0217 出版日期： 2013/05/01 作者姓名： Shafer, Scott M.;Volk, Charles 商品類別： Operations management 商品規格： 15p 再版日期： 地域： United States 產業： Electronics manufacturing 個案年度： -
商品敘述：
General Micro Electronics (GME) designed, assembled, and tested semiconductors for wireless, memory management, wire line telecommunications, and networking applications. In January it purchased a new wire-bonder machine to support its growing contract assembly business. For the first couple of months the new machine performed well, but then its performance became more erratic and eventually was no longer meeting its internal standard for wire-bond strength. The strength of the wire-bond was an important quality dimension of semiconductor chips. With the use of overtime on the existing wire-bonding equipment being very close to full utilization, the need to improve the performance of the new wire-bonding machine was becoming critical. GME''s operations personnel were continuously tweaking the new machine in an effort to find a combination of process parameters that would improve the machine''s performance. Unfortunately, the performance of the machine continued to deteriorate.
涵蓋領域：
Process improvement;Quality control
相關資料：
, (NA0218), 25p, by Scott M. Shafer, Charles Volk
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